Company Profile
       Competitive Advantages
       Business Model
       Technical Expertise
       Major Customers
       Management Team




Company Profile
Epicom is a Taiwan-based fabless, RF front-end chip and FEM solution provider, serving wireless OEM, ODM and EMS customers. Epicom focuses on innovative RF front-end integrated solutions using advanced semiconductor technology for existing and emerging mobile communication platforms. Epicom's highly experienced design team provides the most integrated and cost-effective solutions to answer its customers' end-product development and time-to-market need.

Competitive Advantages
1. Epicom has a strong team with the best RF front-end technology and is close in proximity to its major customers and strategic partners.
2. Epicom's RF front-end integrated solution will yield higher performance and lower production cost for its customers' products.
3. Epicom is in a unique position to provide its valued customers with state of the art wireless front-end technology, fast time-to-market products, and low-cost high-volume production.

Business Model
1. Epicom is a Taiwan based, fabless RF front-end solution company focused on its chip and module products with emphasis on developing intellectual property (IP) for volume production.
2. Epicom benefits from state of the art RF technology and leverage on strategic partners in Taiwan/Asia Pacific for low-cost and high-volume production.

Technical Expertise
Epicom's technical group has more than 100 man-years of combined experience in microwave IC (MMIC), radio-frequency IC (RFIC) and sub-system design, development, manufacturing, and applications. We have expertise in all of the areas relevant to wireless design from device modeling package 3D simulation to system architecture design. Our work covers the commercial, industrial, and defense fields, with radio frequency experience ranging from a few megahertz, up to 40GHz. Our experience covers a broad range:
(1) MMIC design (SiGe, CMOS, GaAs and InP)
(2) RF device modeling (FET, HEMT, BJT, HBT, diodes)
(3) Semiconductor fabrication (GaAs, InP, devices, MMIC, OEIC)
(4) RF wafer, device and IC testing up to 50GHz
(5) RF module and RF system design

Major Customers
1. Major communication and IT system houses requiring high yield embedded RF front-end module solutions.
2. Major ODM/OEM customers requiring cost down and/or custom solutions for fast time-to-market products.
3. Wireless component customers requiring Linearized active devices for their subsystem modules.

Management Team
Chairman - Kenneth Tai
Mr. Tai currently sits on the Board of Directors of several hi-tech companies. Mr. Tai was also one of the co-founders of the Acer Group.
Mr. Tai received his Bachelor of Science degree in Electrical Engineering from the National Chiao Tung University in Taiwan and Master of Business Administration degree from Tamkang University in Taiwan.

President and CEO - Yi-Ching Pao
Yi-Ching Pao received his B.S. degree in Electrophysics from National Chiao-Tung University (Taiwan, R.O.C.), the MSEE degree from Pennsylvania State University, and the Ph.D. degree in Electrical Engineering from Stanford University.
He pioneered the effort of developing a number of state-of-the-art devices and Integrated Circuits which won him the 1992 IEEE MTT Prize Award, and two International R&D100 Awards for the most significant new technology development. Yi-Ching Pao was also elected an IEEE fellow in the year 2000.
He has over 18 years of industrial experience at Varian, Litton (Filtronics), and later a founder and CEO of Oepic, working on high speed devices, MMICs, and OEICs.

Vice President, Engineering - Cindy H. C. Yuen
Cindy Yuen received the B.S. degree in Physics from Tsing Hua University in Taiwan and the M.S. and Ph.D. degrees in Physics from Stanford University.
She started her career with Varian working on the developments of Ku-band power MMICs. In 1993, she joined Space Systems/Loral as the Manager of Advanced MMIC/MIC Development. She was later promoted to Engineering Department Manager of RF Electronics and Department Manager of RF Electronics Product Line responsible for the design and development of receivers, channel amplifier and linearizer products as well as establishing the technical capabilities in digital communication and signal processing.
She has authored over fifty technical papers and co-authored one book, principally in the field of high speed devices, MMICs, and OEICs. She is the recipient of the 1988 R&D-100 award for the development of 2-20 GHz HEMT MMIC amplifier.

Vice President, Operations - David Wang
David Wang received his BS, MSEE and EMBA degrees from National Chiao Tung University. Mr. Wang has over 18 years of experience in communications and instrumentation market. He was also the 1997 Outstanding Young Engineer Award winner. He was formerly VP of Engineering and Manufacturing of Radiantech.

Chief Scientist - C-K Clive Tzuang
Ching-Kuang C. Tzuang received the B.S. degree in Electronic Engineering from the National Chiao Tung University, Hsinchu, Taiwan, the M.S. degree from the University of California at Los Angeles, and the Ph.D. degree in Electrical Engineering from the University of Texas at Austin, where he worked on high-speed transient analyses of monolithic microwave integrated circuits. In the early 1980's, he was with TRW, Redondo Beach, CA, working on analog and digital monolithic microwave integrated circuits. Since 1986, he has been with the Institute of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan.
Ching-Kuang C. Tzuang is also the IEEE fellow with 20 years of industry and research experience. Currently Professor and Director, Advanced Radio Technologies and Systems Center at National Chiao Tung University and at the National Taiwan University (NTU).

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